VESTAL, N.Y. — NextFlex has designated Binghamton University to be the New York “node” for its flexible hybrid electronics (FHE) initiative.
A “node” is a designation aimed at increasing the “volume, pace and coordination” of FHE development in its respective region.
As the NextFlex New York node, Binghamton will design, develop and manufacture tools; process materials and products for flexible hybrid electronics; and “attract, train and employ” an advanced-manufacturing workforce, “building on the region’s existing” electronics manufacturing base, Binghamton University said in a news release.
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Binghamton University has been a “leader in the advancement” of flexible-electronics manufacturing “for more than a decade,” Mark Poliks, professor of systems science and industrial engineering and director of the Center for Advanced Microelectronics Manufacturing at Binghamton University, contended.
“It was our expertise and strong industry partnerships that solidified New York as a powerful resource within this NextFlex alliance. Our university, along with our industry and academic collaborators, have continued to excel in advancing flexible hybrid electronics technologies, and we are pleased to be recognized officially as the New York node for this important initiative,” said Poliks.
Formed in 2015 through a cooperative agreement between the U.S. Department of Defense and FlexTech Alliance, San Jose, California–based NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE, according to the NextFlex website.
Besides Binghamton, NextFlex academic institutions also include Rochester Institute of Technology, Clemson University, Massachusetts Institute of Technology, Purdue University, Stanford University, and the University of Connecticut, according to the NextFlex website.
Nodes
Nodes are developed to foster collaboration and benefit NextFlex members by providing access to facilities, equipment and infrastructure to “fast-track” FHE design, development and manufacturing adoption.
A node “supports the national NextFlex mission,” which is to facilitate FHE technology “innovation;” accelerate the development of the manufacturing workforce; and “promote sustainable” advanced-manufacturing ecosystems in the U.S.
The FHE initiative focuses on defense, medical, and industry applications. They include health and human-performance monitoring patches; medical devices; sensors; imaging systems; prosthetic devices; energy storage; and energy-harvesting devices.
One specific application “could be something as simple” as a bandage that can sense when a wound is infected, Binghamton said.
The New York node will anchor a “regional mechanism” for workforce-development activities and support the “emerging” regional supply chain, including materials suppliers, system integrators, equipment manufacturers, academic institutions, and research centers. The node will extend “cost-effective access” to existing lab and pilot-manufacturing facilities based at Binghamton University and the Rochester Institute of Technology to the NextFlex member community for “collaborative” development of FHE and seek additional opportunities to expand these facilities.
“Bridging the gap between applied research and large-scale product manufacturing is what this NextFlex initiative is all about,” Binghamton University President Harvey Stenger said in the school’s news release. “We are so proud to play such an important role in this nationwide effort, and today’s announcement once again solidifies Binghamton’s reputation as a leader in flexible electronics research and development.”
Contact Reinhardt at ereinhardt@cnybj.com
